Relation between mildly activated flux and N2 system

No clean process after soldering has become standard. Accordingly, the mildly activated flux, which remains residue less than activated one, has prevailed.

Remaining flux on soldering area can damage the unit by corrosion so that a good cleaning with flux remover is required. However, some substances in flux remover are environmentally limited to use and no clean process has become mainstream, which causes the poor solderbility due to a low activity in mildly activated flux.

At the same time, soldering with lead-free solder has also become standard.

A problem was revealed that lead (Pb) contained in soldering materials of waste electronic components was melted away by acid rain and contaminated groundwater. Since then, the usage of lead-free solder has prevailed due to environment-friendliness. However, the solder workability is adversely affected by the poor wettability of the lead-free soldering with mildly activated flux.

N2 system improves solderbility of lead-free solder with mildly activated flux.

Ability to prevent oxidation and pre-heat workpieces resolves issues associated with mildly activated flux.

  • Cleaning:
    Enables solder to spread excellently by removing oxides and stain on metal surface.
  • Preventing re-oxidation:
    Enables solder to be prevented from re-oxidizing by covering metal surface and isolating air.
  • Lowering surface tension:
    Enables solder to spread evenly and excellently by lowering solder surface tension.