In Shape BCM/CM, surface tension of solder in the hollow section:
|Enables bridging to be corrected;
When the tip is placed, solder left in a hollow section absorbs solder in the bridge section.
Prevents bridging from occurring when drag soldering;
Since the pulling force due to surface tension of this type is stronger than that of Shape BC, solder is not left in unnecessary areas during drag soldering.
|Feed solder on a hollow section and drag the tip along slowly.
Apply flux to leads and land pads before soldering. It prevents the troubles such as solder bridge.
See the movie for further details,
|1. Clean solder left in the hollow section by a cleaning sponge, etc.
A small amount of solder may be left in the hollow section.
2. Put the tip on the bridge section and drag it.
Put the hollowed surface on the bridge section