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NC600 Qualitek No Clean Delta Solder Wire 1.27mm Tin 60/40 Lead Alloy 2.2% Flux 500G
Excluding VAT
NC600( No-Clean)
Utilizing synthetically refined resin and a very effective
activator, NC600 wets and spreads like an RA type.
NC600 exhibits virtually no splattering. NC600
conforms to QQ-S-571 and J-STD-004
Alloy Sn60/Pb40
Melting Range 183-190 C
Flux Core
Qualitek has developed a no clean flux system that may be used for both lead-containing alloys and lead-free alloys. It provides the fluxing activity levels that promote fast wetting action and maximum wetting spread. Utilizing synthetically refined resin and very effective activator, NC600 wets and spreads like an RA type flux core. NC600 exhibits virtually no spattering and leaves minimal residue.
Main Features
- Excellent wettability
- Yields clear, non-conductive residues
Technical Data (Flux Extract)
Color & Appearance | Light yellow opaque solid | Visual |
Flux Classification | REL0 | J-STD-004 |
Copper Mirror | No removal of copper film | IPC-TM-650 2.3.32 |
Corrosion SIR | Pass | IPC-TM-650 2.6.15 |
J-STD-004,Pattern Down | 2.05 x 1011 | IPC-TM-650 2.6.3.3 |
Electromigration | Pass | Bellcore GR-78-CORE 13.1.4 |
Post Reflow Flux Residue | 55% | TGA Analysis |
Acid Value | 190 - 210 | IPC-TM-650 2.3.13 |
Flux Residue Dryness | Pass | IPC-TM-650 2.4.47 |
Spitting of Flux-Cored Solder | 0.3% | IPC-TM-650 2.4.48 |
Solder Spread | 100 mm2 | IPC-TM-650 2.4.46 |
Wire Diameter
Sn63/Pb37 NC600 Delta Solder Wire is available in a variety of diameters. The chosen diameter is based on application methods, pad size, and desired solder joint volume. Generally, the diameter of the wire should be slightly larger than the width/diameter of the joint or connection to be soldered. Below is a list of standard diameters.
Standard wire diameters
Diamter/Inch | 0.125 | 0.092 | 0.062 | 0.050 | 0.040 | 0.032 | 0.028 | 0.025 | 0.020 | 0.015 |
Diameter/mm | 3.18 | 2.33 | 1.57 | 1.27 | 1.01 | 0.81 | 0.71 | 0.63 | 0.51 | 0.38 |
Std.Wire Gauge | 11 | 13 | 16 | 18 | 19 | 21 | 22 | 23 | 25 | 28 |
Tolerance, in. | +/-0.006 | +/-0.005 | +/-0.003 | +/-0.003 | +/-0.002 | +/-0.002 | +/-0.002 | +/-0.002 | +/-0.002 | +/-0.002 |
Flux Percentage
Qualitek utilizes a state-of–the-art automatic wire extrusion and wire drawing machines to manufacture consistent solder. The introduction of flux core in the wire extrusion process involves continual monitoring of flux percentage to ensure minimal flux voids and irregular wire. Typical flux percentage for leaded solder is 1.1 – 3.3%.
Physical Properties
Solder Composition
Qualitek has developed a no clean resin based core flux with alloy composition, Sn63/Pb37, which is a eutectic alloy. Qualitek Sn63/Pb37 alloy conforms to and exceeds the impurity requirements of IPC-J-STD-006C.
Typical Analysis | |||||||||||||
Sn | Ag | Cu | Pb | Sb | Bi | In | As | Fe | Ni | Cd | Al | Zn | Au |
62.5 –63.5 | 0.100 Max | 0.080 Max | Bal | 0.200 Max | 0.100 Max | 0.100 Max | 0.030 Max | 0.020 Max | 0.010 Max | 0.002 Max | 0.005 Max | 0.003 Max | 0.050 Max |
Sn63/Pb37 | |
Melting Point, °C | 183 E |
Hardness, Brinell | 14 HB |
Coefficient of Thermal Expansion | 24.7 |
Tensile Strength, psi | 4442 |
Density, g/cm3 | 8.42 |
Electrical Resistivity, (μΩ-cm) | 14.5 |
Electrical Conductivity, 104/ohm-cm | 6.9 |
Sn63/Pb37 | |
Yield Strength, psi | 3950 |
Total Elongation,% | 48 |
Joint Shear Strength, at 0.1mm/min 20 °C | 23 |
Joint Shear Strength, at 0.1mm/min 100 °C | 14 |
Creep Strength, N/mm2 at 0.1mm/min 20 °C | 3.3 |
Creep Strength, N/mm2 at 0.1mm/min 100 °C | 1 |
Joint Fatigue Cycle, 15N/mm2 20 °C 10N/mm2 100 °C | 1100 900 |
Flux Residues & Cleaning
NC600 is a no clean formulation; therefore, the residues do not need to be removed for typical applications. If residue removal is desired, the use of Everkleen 1005 Buffered Saponifier with a 5-15% concentration in hot 60 °C (140 °F) de-ionized water will aid in residue removal.
Category | Title | Size |
---|---|---|
SDS | N600 Alloy SDS | 69 KB |
TDS | N600 Alloy TDS | 110 KB |