NC600 Qualitek No Clean Delta Lead Free Solder Wire SAC305 Alloy 0.508mm 2.2% Flux 500G

£70.33
Excluding VAT
In stock
SKU
HNC600-0.5LF-500G

NC600( No-Clean)
Utilizing synthetically refined resin and a very effective
activator, NC600 wets and spreads like an RA type.
NC600 exhibits virtually no splattering. NC600
conforms to QQ-S-571 and J-STD-004.

Alloy SAC305 (965-30)Lead Free Sn96.5/Ag3/Cu0.5
Melting Range 217-218 C

click to enlarge image

Flux Core

Qualitek has developed a no clean flux system that is available with both lead-containing alloys and high melting temperature Sn/Ag/Cu alloys, such as SAC305 and SAC405. It provides the fluxing activity levels that promote fast wetting action and maximum wetting spread. Utilizing synthetically refined resin and very effective activator, NC600 wets and spreads like an RA type flux core. NC600 exhibits virtually no spattering and leaves minimal
residue.

Main Features

  • Excellent wettability
  • Yields clear, non-conductive residues
  • RoHs compliant

 

Technical Data (Flux Extract)

Color & Appearance Light yellow opaque solid Visual
Flux Classification REL0 J-STD-004
Copper Mirror No removal of copper film IPC-TM-650 2.3.32
Silver Chromate Pass IPC-TM-650 2.3.33
Corrosion  Pass IPC-TM-650 2.6.15
JSTD-004,Pattern Down 1.89 x 1011 IPC-TM-650 2.6.3.3
Electromigration Pass Bellcore GR-78-CORE 13.1.4
Post Reflow Flux Residue 55% TGA Analysis
Acid Value (mgKOH/g) 190 - 210 IPC-TM-650 2.3.13
Flux Residue Dryness Pass IPC-TM-650 2.4.47
Spitting of Flux-Cored Solder 0.3% IPC-TM-650 2.4.48
Solder Spread 100 mm2 IPC-TM-650 2.4.46

Wire Diameter

Delta Solder Wire NC600 with tin/silver copper alloys is available in a variety of diameters. The chosen diameter is
based on application methods, pad size, and desired solder joint volume. Generally, the diameter of the wire should be slightly larger than the width/diameter of the joint or connection to be soldered. Below is a list of standard diameters.

Standard wire diameters

Diamter/Inch 0.125 0.092 0.062 0.050 0.040 0.032 0.028 0.025 0.020 0.015 0.010
Diameter/mm 3.18 2.33 1.57 1.27 1.01 0.81 0.71 0.63 0.51 0.38 0.25
Std.Wire Gauge 11 13 16 18 19 21 22 23 25 28 31
Tolerance, in. +/-0.006 +/-0.005 +/-0.003 +/-0.003 +/-0.002 +/-0.002 +/-0.002 +/-0.002 +/-0.002 +/-0.002 +/-0.002

Flux Percentage

Qualitek utilizes a state-of–the-art automatic wire extrusion and wire drawing machines to manufacture consistent solder. The introduction of flux core in the wire extrusion process involves continual monitoring of flux percentage to ensure minimal flux voids and irregular wire. Typical flux percentage for high temperature lead-free SAC-containing alloy solder is 1.1 – 3.3%.

Physical Properties

Solder Composition

Qualitek has developed a no clean resin based core flux with tin/silver/copper (SAC) alloys. Qualitek SAC alloys conform to and exceed the impurity requirements of IPC-J-STD-006C.

Typical Analysis
  Sn Ag Cu Pb Sb Bi In As Fe Ni Cd Al Zn Au
LF955-38 Bal 3.6-4.0 0.5-0.9 0.070
Max
0.200
Max
0.100
Max
0.100
Max
0.030
Max
0.020
Max
0.010
Max
0.002
Max
0.005
Max
0.003
Max
0.050
Max
LF958-35 Bal 3.3-3.7 0.5-0.9 0.070
Max
0.200
Max
0.100
Max
0.100
Max
0.030
Max
0.020
Max
0.010
Max
0.002
Max
0.005
Max
0.003
Max
0.050
Max
LF965-30 Bal 2.8-3.2 0.3-0.7 0.070
Max
0.200
Max
0.100
Max
0.100
Max
0.030
Max
0.020
Max
0.010
Max
0.002
Max
0.005
Max
0.003
Max
0.050
Max
LF217 Bal 3.8-4.2 0.3-0.7 0.070
Max
0.200
Max
0.100
Max
0.100
Max
0.030
Max
0.020
Max
0.010
Max
0.002
Max
0.005
Max
0.003
Max
0.050
Max

 

  Sn/Ag/Cu Sn63/Pb37
Melting Point, °C 217-221 183 E
Hardness, Brinell 15HB 14HB
Coefficient of Thermal Expansion Pure Sn= 23.5 24.7
Tensile Strength, psi 4312 4442
Density, g/cm3 7.39 8.42
Electrical Resistivity, (μΩ-cm) 13.0 14.5
Electrical Conductivity, 104/ohm-cm 16.6 11.9

 

  Sn/Ag/Cu Sn63/Pb37
Yield Strength, psi 3724 3950
Total Elongation,% 27 48
Joint Shear Strength, at 0.1mm/min 20 °C 27 23
Joint Shear Strength, at 0.1mm/min 100 °C 17 14
Creep Strength, N/mm2 at 0.1mm/min 20 °C 13.0 3.3
Creep Strength, N/mm2 at 0.1mm/min 100 °C 5 1
Thermal Conductivity, W/m.K 58.7 50.9

Flux Residues & Cleaning

NC600 is a no clean formulation; therefore, residue removal is not required for typical applications. If residue removal is desired, the use of Everkleen 1005 Buffered Saponifier with a 5-15% concentration in hot 60 °C (140 °F) de-ionized water will aid in residue removal..

Tech Tips

Category Title Size
SDS N600 Lead-Free SDS 55 KB
TDS N600 Lead-Free TDS 106 KB