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NC600 Qualitek No Clean Delta Lead Free Solder Wire SAC305 Alloy 0.508mm 2.2% Flux 500G
£70.33
Excluding VAT
Excluding VAT
SKU
HNC600-0.5LF-500G
NC600( No-Clean)
Utilizing synthetically refined resin and a very effective
activator, NC600 wets and spreads like an RA type.
NC600 exhibits virtually no splattering. NC600
conforms to QQ-S-571 and J-STD-004.
Alloy SAC305 (965-30)Lead Free Sn96.5/Ag3/Cu0.5
Melting Range 217-218 C
Flux Core
Qualitek has developed a no clean flux system that is available with both lead-containing alloys and high melting temperature Sn/Ag/Cu alloys, such as SAC305 and SAC405. It provides the fluxing activity levels that promote fast wetting action and maximum wetting spread. Utilizing synthetically refined resin and very effective activator, NC600 wets and spreads like an RA type flux core. NC600 exhibits virtually no spattering and leaves minimal
residue.
Main Features
- Excellent wettability
- Yields clear, non-conductive residues
- RoHs compliant
Technical Data (Flux Extract)
| Color & Appearance | Light yellow opaque solid | Visual |
| Flux Classification | REL0 | J-STD-004 |
| Copper Mirror | No removal of copper film | IPC-TM-650 2.3.32 |
| Silver Chromate | Pass | IPC-TM-650 2.3.33 |
| Corrosion | Pass | IPC-TM-650 2.6.15 |
| JSTD-004,Pattern Down | 1.89 x 1011 | IPC-TM-650 2.6.3.3 |
| Electromigration | Pass | Bellcore GR-78-CORE 13.1.4 |
| Post Reflow Flux Residue | 55% | TGA Analysis |
| Acid Value (mgKOH/g) | 190 - 210 | IPC-TM-650 2.3.13 |
| Flux Residue Dryness | Pass | IPC-TM-650 2.4.47 |
| Spitting of Flux-Cored Solder | 0.3% | IPC-TM-650 2.4.48 |
| Solder Spread | 100 mm2 | IPC-TM-650 2.4.46 |
Wire Diameter
Delta Solder Wire NC600 with tin/silver copper alloys is available in a variety of diameters. The chosen diameter is
based on application methods, pad size, and desired solder joint volume. Generally, the diameter of the wire should be slightly larger than the width/diameter of the joint or connection to be soldered. Below is a list of standard diameters.
Standard wire diameters
| Diamter/Inch | 0.125 | 0.092 | 0.062 | 0.050 | 0.040 | 0.032 | 0.028 | 0.025 | 0.020 | 0.015 | 0.010 |
| Diameter/mm | 3.18 | 2.33 | 1.57 | 1.27 | 1.01 | 0.81 | 0.71 | 0.63 | 0.51 | 0.38 | 0.25 |
| Std.Wire Gauge | 11 | 13 | 16 | 18 | 19 | 21 | 22 | 23 | 25 | 28 | 31 |
| Tolerance, in. | +/-0.006 | +/-0.005 | +/-0.003 | +/-0.003 | +/-0.002 | +/-0.002 | +/-0.002 | +/-0.002 | +/-0.002 | +/-0.002 | +/-0.002 |
Flux Percentage
Qualitek utilizes a state-of–the-art automatic wire extrusion and wire drawing machines to manufacture consistent solder. The introduction of flux core in the wire extrusion process involves continual monitoring of flux percentage to ensure minimal flux voids and irregular wire. Typical flux percentage for high temperature lead-free SAC-containing alloy solder is 1.1 – 3.3%.
Physical Properties
Solder Composition
Qualitek has developed a no clean resin based core flux with tin/silver/copper (SAC) alloys. Qualitek SAC alloys conform to and exceed the impurity requirements of IPC-J-STD-006C.
| Typical Analysis | ||||||||||||||
| Sn | Ag | Cu | Pb | Sb | Bi | In | As | Fe | Ni | Cd | Al | Zn | Au | |
| LF955-38 | Bal | 3.6-4.0 | 0.5-0.9 | 0.070 Max |
0.200 Max |
0.100 Max |
0.100 Max |
0.030 Max |
0.020 Max |
0.010 Max |
0.002 Max |
0.005 Max |
0.003 Max |
0.050 Max |
| LF958-35 | Bal | 3.3-3.7 | 0.5-0.9 | 0.070 Max |
0.200 Max |
0.100 Max |
0.100 Max |
0.030 Max |
0.020 Max |
0.010 Max |
0.002 Max |
0.005 Max |
0.003 Max |
0.050 Max |
| LF965-30 | Bal | 2.8-3.2 | 0.3-0.7 | 0.070 Max |
0.200 Max |
0.100 Max |
0.100 Max |
0.030 Max |
0.020 Max |
0.010 Max |
0.002 Max |
0.005 Max |
0.003 Max |
0.050 Max |
| LF217 | Bal | 3.8-4.2 | 0.3-0.7 | 0.070 Max |
0.200 Max |
0.100 Max |
0.100 Max |
0.030 Max |
0.020 Max |
0.010 Max |
0.002 Max |
0.005 Max |
0.003 Max |
0.050 Max |
| Sn/Ag/Cu | Sn63/Pb37 | |
| Melting Point, °C | 217-221 | 183 E |
| Hardness, Brinell | 15HB | 14HB |
| Coefficient of Thermal Expansion | Pure Sn= 23.5 | 24.7 |
| Tensile Strength, psi | 4312 | 4442 |
| Density, g/cm3 | 7.39 | 8.42 |
| Electrical Resistivity, (μΩ-cm) | 13.0 | 14.5 |
| Electrical Conductivity, 104/ohm-cm | 16.6 | 11.9 |
| Sn/Ag/Cu | Sn63/Pb37 | |
| Yield Strength, psi | 3724 | 3950 |
| Total Elongation,% | 27 | 48 |
| Joint Shear Strength, at 0.1mm/min 20 °C | 27 | 23 |
| Joint Shear Strength, at 0.1mm/min 100 °C | 17 | 14 |
| Creep Strength, N/mm2 at 0.1mm/min 20 °C | 13.0 | 3.3 |
| Creep Strength, N/mm2 at 0.1mm/min 100 °C | 5 | 1 |
| Thermal Conductivity, W/m.K | 58.7 | 50.9 |
Flux Residues & Cleaning
NC600 is a no clean formulation; therefore, residue removal is not required for typical applications. If residue removal is desired, the use of Everkleen 1005 Buffered Saponifier with a 5-15% concentration in hot 60 °C (140 °F) de-ionized water will aid in residue removal..
| Category | Title | Size |
|---|---|---|
| SDS | N600 Lead-Free SDS | 55 KB |
| TDS | N600 Lead-Free TDS | 106 KB |